Proceedings Vol. 30 (2024)
ENGINEERING MECHANICS 2024
May 14 – 16, 2024, Milovy, Czech Republic
Copyright © 2024 Brno University of Technology, Institute of Solid Mechanics, Mechatronics and Biomechanics, Brno
ISSN 1805-8248 (printed)
ISSN 1805-8256 (electronic)
list of papers scientific commitee
pages 262 - 265, full text
The area of embedded sensors, adaptronics, smart material and smart structures has a key role in Structural Health Monitoring. The aim of embedding smart materials into engineering structures is to monitor a wide variety of material’s properties and enabling continuous or permanent measurements of their structural integrity. The integration of sensors into the structure is limited to processing technology used for embedding sensors and the possibility to damage the structure during insertion. This study focuses on developing sensory structure with force to voltage amplifying capabilities. The base unit and periodic concept of such structure is developed, and FEM model of base unit is done to observe basic behavior under load. Experiments with base unit for its voltage response were carried out on a prototype. Furthermore, a three base unit sample is created and a concept of a planar three-layer structure is developed.
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All papers were reviewed by members of the scientific committee.